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PVD(Physical Vapor Deposition):
Physical vapor deposition refers to the use of low-voltage and high current arc discharge technology under vacuum, the use of gas discharge to evaporate the target and ionize the evaporated material and gas, and the acceleration of electric field to deposit the evaporated material and its reaction products on the workpiece.
It is generally used for surface modification or coating.
Including vacuum evaporation, ion sputtering, ion plating, etc.
① Ion sputtering coating technology:
Ion sputtering coating technology is a technology that bombards the target surface with charged particles in a vacuum chamber, knocks out atoms and other particles in the target through particle momentum transfer, and deposits them on the substrate to form a thin film.
Particle sputtering coating can achieve large-area rapid deposition, high coating density and good adhesion.
② Application:
Sputtering coating materials are not limited. All materials that can be made into targets can be sputtered into films, which are widely used in machinery, electronics, chemistry, optics, plastics and other industries.
The application of ion sputtered MoS2 in bearing solves the lubrication problem of bearing and realizes solid self-lubrication.
Chemical vapor deposition technology is a chemical vapor growth method, which supplies one or more compounds and elemental gases containing film elements to the substrate, and generates the required film by gas phase action or chemical reaction on the substrate surface.
Coating layer: tic, tin, Ti (CN), Al2O3, ZrO2, TiO2, diamond or diamond-like carbon.
Using CVD technology, the ceramic of steel ball or roller can be realized, and a ceramic layer can be formed on the surface of metal ball or roller to improve the wear resistance, temperature resistance, lubricity, corrosion resistance and other properties of rolling element. Such as aircraft door bearing ball.
Physical vapor deposition (PVD) technology
Physical vapor deposition (PVD) is a technology that uses physical processes such as thermal evaporation, ion sputtering or glow discharge to deposit the required coatings on the substrate surface.
Physical vapor deposition can be used to deposit metal, alloy, oxide, nitride, carbide and other films; The film has strong adhesion, low process temperature and generally no or little deformation.
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